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January 27, 2014

Peapack, NJ (USA) and Basel, Switzerland, 27 January 2014 -- Novoset, LLC and Lonza are pleased to announce the introduction of PrimasetTM ULL-950 and PrimasetTM HTL-300 ultra-low loss and high- temperature thermoset materials for the telecommunication and advanced semiconductor packaging industries...

March 28, 2013

Peapack, New Jersey, March 28, 2013: Novoset , LLC has today officially announced the opening of its Design and Development Technology Center to support the growing advanced material demand for the high speed telecommunication and semiconductor industries. In addition the Technology Center will deve...

February 1, 2013

Basel, Switzerland and Peapack, NJ (USA), 01 February 2013 – Lonza Ltd and Novoset LLC are pleased to announce the introduction of a new generation of thermoset polyimides. The new polyimides address shortcomings of conventional high temperature polyimides currently available in the market and will...

August 11, 2011

Lonza, JFC Technologies and Novoset LLC announce a strategic collaboration to advance high performance materials offerings.

 Lonza, JFC Technologies and Novoset LLC announce today they have entered into a specialized production and marketing collaboration for Lonza’s High Performance Materials (HPM)...

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Novoset, LLC enters into collaboration with Lonza, JFC Technologies

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