Novoset, LLC and Lonza Announce the Introduction of New, Ultra-Low Dielectric Loss and High-Temperature Materials for High- Speed Telecommunication Industries and Bendable Electronic Devices

January 27, 2014


Peapack, NJ (USA) and Basel, Switzerland, 27 January 2014 -- Novoset, LLC and Lonza are pleased to announce the introduction of PrimasetTM ULL-950 and PrimasetTM HTL-300 ultra-low loss and high- temperature thermoset materials for the telecommunication and advanced semiconductor packaging industries. These thermoset resins are based on Cyanate Ester (CE) chemistry. 


PrimasetTM ULL-950 is suitable for high-performance applications such as power amplifiers for 4G LTE and 4G LTE advanced base stations for smartphones, internet infrastructure and high-layer count servers for “cloud computing”. Low dielectric properties coupled with high glass-transition temperature (Tg) make PrimasetTM HTL-300 an ideal candidate for advanced Integrated Circuit (IC) substrates for semiconductor packaging materials and next-generation application processors for mobile chips. 


Depending on the backbone structure, PrimasetTM ULL-950 has a dissipation factor (Df) ranging from 0.0009 to 0.003 and a dielectric constant (Dk) between 2.3 - 2.6 up to 40 GHz. The Tg can vary between 175 ̊C and 320 ̊C. High-temperature bendable devices can be fabricated utilizing its flexibility. 


These products also exhibit low moisture uptake and short lamination cycles. The high-temperature capabilities and toughness are critical for lead-free assemblies in Printed Circuit Boards (PCB) and build-up films. Low moisture uptake and wet Tg retention with toughness also may open the door for the use of these Cyanate Esters for structural aerospace applications. 




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