Applications and New Product  Development

 Applications and products which have been successfully developed  and under development are:


• IC and HDI substrates semiconductor package for iPhone and iPad
• Resin infusion formulation to meet airduct FST requirement to replace current prepreg technology 
• Space and satellite structures
• Formula 1 racing car components
• High-end router and server for telecommunication
• Composite structures using Resin Transfer Technology and Filament Winding

•5G substrates (mm Wave) for IOT and M2M applications ​

•3D materials for various high temperature and high strength applications 

•High temperature molding compounds for semiconductor packaging industries for electrical and hybrid cars

•Low Df Flame retardant Materials 

•Custom made resin infusion resins for commercial aircraft interior structures 

•Rapid cure Catalyst ( NovoCure 200 and NovoCure 275 ™)

•High strength PU and epoxy for liquid process applications

(908) 470-4200

87 Main St, Peapack, NJ 07977, USA