We are a system solution provider of advanced materials for the semiconductor packaging industries (IC substrates) for Smartphone and various other advanced packaging hardware. Our services and products are also used in telecommunication and in the server market which power “cloud computing “. The low dielectrics at very high frequency coupled with high Tg are our offerings to the electronics industries.
We are also active in microelectronic adhesives, encapsulation and in the semiconductor material packaging market.
We have developed and commercialized modified hydrocarbon resin systems for various Fifth Generation (5G) related electronics applications. These resins are specifically designed for use in devices enabling innovative next generation 5G technologies like Advanced Driver Assisted Systems (ADAS). These materials are an alternative to Teflon™ for mobility and communication substrates.
Next Generation Ultra Low Loss Mobility and Communication Materials